Gelid GC-4 Thermal Paste 3.5g (TC-GC-04-B)

Density (g/cm): 2.30

Viscosity (Poise): 1000

Working Temperature (°C): -30~150

Net Content: 3.5g

The State-of-the-Art Thermal Compound

Created for professional and extreme users to provide the best thermal interface and to achieve ultra-efficient heat transfer from your CPU, GP and Chipset in mission critical applications.

GC-4 comes with the enhanced micron-particle synthetic thermal filler and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity. It is also non-electrical conductive and included an additional applicator for super easy application.

Ultimate Heat Conductivity
GC-4 comes with the enchanced micron-particle synthetic thermal filter and polyer matrix to ensure ultimate conductivity, perfect gap filling and optimal viscosity 

Non-Electrical Conductive

Ultra-Durable & Non-Curing
Stable performance under a wide range of temperatures, ranging from -30 ~ 150 oC

No Bleeding & User Friendly